Today ASUS is announcing its newest flagship gaming-oriented phone, the ROG Phone III. A direct successor to the quite well received ROG Phone II from last year, the company is keeping the formula quite basic this year, keeping the general characteristics of the ROG Phone III similar to that to its predecessor whilst upgrading the core components such as the SoC, now featuring for the first time in a device the new Snapdragon 865+.
The new SoC upgrades the CPU and GPU speeds by 10%, upping the frequencies on the Cortex-A77 cores to up to 3.1GHz for the first time ever in a smartphone. ASUS says that it’s also vastly upgraded the heat sink of the SoC inside the phone, with it now being 6x larger than that found on the ROG Phone II. Combined with a revamped vapour chamber design, the new phone is said to be virtually immune to thermal throttling and is able to keep is peak performance figures for prolonged periods even in demanding situations.
